I7 3770K INTEL BURN TEST GFLOPS FULL
Then the protective features do not activate at all and you have full CPU performance at the higher overclock. Keep in mind the information above quoted from Intel is covering stock clocked Intel CPUs not overclocked, and when we overclock the CPU we change parameters, but the protective features are factory set that we users cannot control, so if you cannot control it, you simply operate under it. It doesn't come across as Bluescreens or Crashes as the CPU still runs, however the more it needs to internally throttle the more obvious the performance drop is seen, with Intel Burn Test the performance drop can be seen in the Speed (GFlops) dropping. My cooling allows the overclock I am running, the 2700K can yield some very impressive overclocks 24/7 stable but you need better cooling than a CMH212EVO to hold down the top end temperatures or the CPU will protect itself. Sturmgewehr_44, Sometimes I come across as critical when actually my intentions are to help you get the most from your overclock as my goal is actually about CPU longevity, many would accuse me of the opposite with a 3770K overclocked to 5ghz, but it is 24/7 stable. The overclock combined with added voltage to stabilize the overclock produces additional heat that accelerates the activation of the CPUs thermal protection. The following sections provide more details on the different TCC mechanisms used by the processor.Ĭlick to expand.The CPU is designed to run in an ambient air environment and all it's built in features is so it can survive past the 3 year warranty covering it, however overclocking pushes it outside it's specification zone into temperatures it's protective features may be activated before they need to be at the speed the CPU is approaching it's heat protection.
I7 3770K INTEL BURN TEST GFLOPS SOFTWARE
The Thermal Monitor does not require any additional hardware, software drivers, or interrupt handling routines.
Refer to the appropriate Thermal Mechanical Design Guidelines for information on designing a compliant thermal solution. In addition, a thermal solution that is significantly under-designed may not be capable of cooling the processor even when the TCC is active continuously. The processor performance impact due to these brief periods of TCC activation is expected to be so minor that it would be immeasurable.Īn under-designed thermal solution that is not able to prevent excessive activation of the TCC in the anticipated ambient environment may cause a noticeable performance loss, and in some cases may result in a TCASE that exceeds the specified maximum temperature and may affect the long-term reliability of the processor. With a properly designed and characterized thermal solution, it is anticipated that the TCC would only be activated for very short periods of time when running the most power intensive applications. TM1 and TM2 will work together (clocks will be modulated at the lowest frequency ratio) to reduce power dissipation and temperature. If TM2 is unable to reduce the processor temperature, then TM1 will be also be activated. When the TCC activation temperature is reached, the processor will initiate TM2 in attempt to reduce its temperature. Snooping and interrupt processing are performed in the normal manner while the TCC is active. The temperature at which Adaptive Thermal Monitor activates the Thermal Control Circuit is factory calibrated and is not user configurable. Ired to select a specific method (as with previous-generation processors supporting TM1 or TM2). The processor intelligently selects the appropriate TCC method to use on a dynamic basis.
Reduces power consumption by modulating (starting and stopping) the internal processor core clocks. The second method (clock modulation, known as Thermal Monitor 1 or TM1 in previous generation processors) This combination of lower frequency and VID results in a reduction of the processor power consumption. The first method (Frequency/VID control, similar to Thermal Monitor 2 (TM2) in previous generation processors) involves the processor reducing its operating frequency (using the core ratio multiplier) and input voltage (using the VID signals). Adaptive Thermal Monitor uses TCC activation to reduce processor power using a combination of methods. The Adaptive Thermal Monitor feature provides an enhanced method for controlling the processor temperature when the processor silicon exceeds the Thermal Control Circuit (TCC) activation temperature.